All qfnqfn are cu lead frames. The exposed metal layer on the top of the package does not mean vastly better thermal performance.
Thermal Resistance For Various Electronic Packages Download Table
Thermal resistance 6 ver2014 09 04 thermal resistance of each package there are typical measured value based on jedec with no wind.
Package thermal resistance table. Each value is dependent on a chip a layout of a leadframe a boa rd and so forth. Altera reserves the right to make changes to thermal resistances without notice in the future. Most generally it is the top surface of the package.
Qjc for cqfp and cclg packages refers to the thermal resistance between the junction and the bottom of the. And o jc junction to case thermal resistance values for the devices. The package thermal resistance values theta ja and theta jc can be useful in determining the thermal response of ics in a jedec constrained environment.
High effective thermal conductivity board jedec 4 layer was used for the calculations. An ic package normally containing a thermal test chip is mounted on a test pcb. Finally this paper introduces a general rule for sot23 package layout and gives an example of ti.
Table 3 thermal resistance of each package tj150 tj150 oja psjt pd pd oja psjt pd pd. Rojc is good to determine the thermal resistance between the die and the surface onto which a heat sink is to be mounted. Each value is dependent on a chip a layout of a leadframe a board and so forth.
Shown in style lead count column. Summarized the procedure is. Dfn and qfn package type dimensions are in millimeter.
Under any other conditions the calculations are likely to deviate from measured parameters. The most commonly documented thermal relationship for ic packages are the junction to air thermal. Thermal resistance of each package there are typical measured value based on jedec with no wind.
The following table provides. Tps560200 device which is a standard banding wire sot23 package the thermal resistance in the jedec standard is 1670cw while the tps563200 device which is the fcol sot23 package the thermal resistance in the jedec standard is 8790cw. Typically the reduction in thermal resistance due to the spreader is of the order of 10 to 20.
Qjc for cg624 refers to the thermal resistance between the junction and the top of the package. For thermal resistance of other device families go to package and thermal resistance. Package thermal resistance package thermal resistance is the measure of the packages heat dissipation capability from a dies active surface junction to a specified reference point case board ambient etc.
The values for plastic packages are for copper material and non fused type unless otherwise. Table 2 gives an example of the type of thermal performance that is observed with the te pbga and the te pbga2.
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